HIGH-PRECISION SiC COMPONENTS
Chucks, stages and structural components.
SiC and porous-ceramic components connect stiffness, low thermal expansion, surface precision and application-specific interfaces for bonding, lithography and precision equipment.
Bonding and debonding chucks
Product options include wafer-bonding chucks, flip-chip holding components and porous-ceramic chucks for debonding applications.
Lithography and precision stages
High stiffness and low thermal expansion support positioning structures, optical bases, guide components and chucks where geometric stability is critical.
Integrated ceramic capability
The supply route covers powder preparation, forming, sintering, precision machining, surface modification, micro-feature manufacturing, cleaning and inspection.
Interface-led customization
Material grade, vacuum circuit, pore structure, mounting datum, surface finish, flatness and cleanliness are defined around the tool and process.
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