SILICON CARBIDE
SiC components for demanding thermal processes.
Wafer boats, cantilever paddles and furnace components support oxidation, diffusion, annealing and CVD environments.
01CAPABILITY DETAILS
Manufacturing capabilities organized by process.
Material advantages
High heat resistance, thermal conductivity, low expansion, stiffness, wear and corrosion resistance support clean high-temperature processing.
Thermal process applications
Components serve oxidation, diffusion, annealing and LPCVD or APCVD environments under repeated thermal cycling.
Wafer handling applications
Wafer boats, carriers, vacuum chucks, stages and guides support stable positioning and low-contamination handling.
Representative components
Product families include SiC wafer boats, cantilever paddles, furnace tubes, chucks, beams and equipment-interface structures.
Wafer-boat manufacturing
Material preparation, 3D forming, sintering, blasting, grinding, lapping, slot cutting, acid washing, cleaning, drying, coating and clean packaging form the complete route.
Precision and cleanliness
Geometry, flatness, surface condition, coating and packaging are defined around equipment interfaces and contamination requirements.
Drawing-led customization
Geometry, material grade, process position, temperature and equipment interface are reviewed before solution definition.
SiC wafer boats & thermal parts
Wafer boats, paddles, furnace tubes and hot-zone components for semiconductor thermal processes.
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High-precision SiC equipment parts
Chucks, stages and structural parts developed around equipment interfaces.
View product details ↗Lithography & inspection chucks
Stable wafer-holding structures for positioning-critical semiconductor equipment.
View product details ↗SiC motion-stage beams
High-stiffness, low-mass structures for fast precision motion.
View product details ↗Lightweight SiC mirrors
Thermally stable optical structures with reduced moving mass.
View product details ↗Custom SiC optical baseplates
Low-expansion foundations for precision optical paths and equipment interfaces.
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