LITHOGRAPHY & INSPECTION CHUCKS
Precision wafer holding for positioning-critical equipment.
Silicon-carbide ring and pin-type chucks combine low thermal expansion, high stiffness, mirror finishing and application-specific vacuum geometry for lithography and wafer inspection systems.
Application position
The technical specification places SiC chucks in lithography worktables and wafer-defect inspection equipment, where repeatable positioning and stable wafer support are critical.
Ring and pin structures
Ring and pin-type holding surfaces can be evaluated around usable wafer area, support-point distribution, vacuum circuit and surface-protection requirements.
Verified precision examples
The product specification records a 0.3–0.5 μm flatness example, mirror-polished surfaces and 6-, 8- and 12-inch size options. Final acceptance values remain subject to drawing, measurement method and equipment interface.
Why silicon carbide
Low thermal expansion, stiffness, wear resistance and lightweight design help reduce geometry drift and moving-stage load in precision systems.
Information for evaluation
Please provide wafer diameter and thickness, equipment model, current chuck photographs or drawings, vacuum layout, mounting datums, target flatness, surface finish and cleanliness criteria.
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